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 PKF 5000 I
5-6 W DC/DC Power Modules Wide Input Series
* SMD and through-hole versions with ultra low component height 8 mm (0.315 in.) * 18-72 V input voltage range * 82% efficiency (typ at 5 V) * 1,500 V dc isolation voltage * Switching frequency syncronization * MTBF > 4.9 million hours at +55C case temperature (+40 C ambient) * Low EMI measured according to CISPR 22 and FCC part 15J
Patents
US: D357901 DE: M94022763
The MacroDensTM PKF 5000 I series true component level on-board DC/DC power modules are intended as distributed power sources in decentralized 24, 48 and 60 V DC power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTBF of more than 4.9 million hour. The highly reliable and rugged over-moulded design and the ultra low height of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) and other demanding industrial applications, with board spacing down to 15 mm or 0.6 in. These DC/DC power modules are optimized for free convection cooling and have an operational ambient temperature
range in compliance with present and future application needs, including non temperature controlled environments. The mechanical design offers the choice of surface mount or through-hole versions, delivered in readyto-use tubes, trays or tape & reel package, and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured using highly automated manufacturing lines with a world-class quality commitment and a five-year warranty. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover.
E
General
Absolute Maximum Ratings
Characteristics TC TS VI VISO Wtr VRC Vadj Case temperature at full output power Storage temperature Continuous input voltage1) Isolation voltage (input to output test voltage) Transient input energy Remote control voltage pin 10,11 Output adjust voltage pin 8, 9 -5 -5 min -45 -55 -0.5 1,500 0.01 +16 + 40 max +100 +125 +75 Unit C C V dc V dc Ws V dc V dc
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner.
NOTES:
Input TC < TCmax unless otherwise specified
Characteristics VI VIoff VIon CI PIi PRC Input voltage range1) Turn-off input voltage Turn-on input voltage Input capacitance Input idling power IO = 0, TC = - 30...+ 90 C (VI = 27V) (VI = 53 V)
(See typical characteristics) (See typical characteristics)
1)
Conditions
min 18 15
typ
max 72
Unit V V
16 17.4 1.4 244 240 18 67 17.9
V mF
2)
The input voltage range 18...72 V dc meets the European Telecom Standard ETS 300 132-2 Nominal input voltage range in 48 V and 60 V dc power systems, - 40.5... -57.0 V and -50.0... - 72.0 V respectively. At input voltages exceeding 72 V (abnormal voltage) the power loss will be higher than at normal input voltage and TC must be limited to max +90 C. Absolute max continuous input voltage is 75 V dc. Output characteristics will be marginally affected at input voltages exceeding 72 V. The test is applicable for through-hole versions.
mW
Input stand-by power
(VI = 27V) TC = - 30...+ 90 C RC connected to pin 17 (VI = 53 V)
mW
Environmental Characteristics
Characteristics Vibration (Sinusoidal) JESD 22-B103
(IEC 68-2-6 Fc)
Test procedure & conditions Frequency Amplitude Acceleration Number of cycles Frequency Acceleration density spectrum Duration Reproducability Peak acceleration Shock duration Temperature Number of cycles Temperature Humidity Duration Temperature, solder Duration Duration Temperature Concentration 10...500 Hz 0.75 mm 10 g 10 in each axis 10...500 Hz 0.5 g2/Hz 10 min in 3 directions medium (IEC 62-2-36) 200 g 3 ms -40C...+125C 500 85C 85% RH 1000 hours 260C 10...13 s 96 h 35C 5%
Random vibration
MIL-STD-883 Method 2026
(IEC 68-2-34 Ed)
Shock (Half sinus) Temperature change Accelerated damp heat Solder resistability2) Aggressive environment
JESD 22-B104
(IEC 68-2-27 Ea)
JESD 22-A104
(IEC 68-2-14 Na)
JESD 22-A101
(IEC 68-2-3 Ca with bias)
JESD 22-B106
(IEC 68-2-20 Tb 1A)
IEC 68-2-11 Ka
2
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Mechanical Data
Through-hole version Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9
40.0 [1.575]
5.0 [0.197] 40.0 [1.575]
3.6 [0.142]
Dimensions in mm (in)
24.0 [0.945] 29.6 [1.165]
18 17 16 15 14 13 12 11 10
2.8 [0.110]
Dimensions in mm (in)
Connections
Weight
Maximum 20 g (0.71 oz).
Pin 1 2 3-6 7 8 9 10 11 12-16 17 18
Designation Out 1 Rtn NC Sync Vadj NOR Aux RC NC -In +In
Function Output 1. Positive voltage ref. to Rtn. Output return. Not connected. Synchronization input. Output voltage adjust. To set typical output voltage (VOi) connect pin 8 to pin 9. Connection of Nominal Output voltage Resistor. (See output voltage adjust p. 12). Internally connected to pin 11. Remote control and turn-on/off input voltage adjust. Used to turn-on and turn-off output. Not connected. Negative input. Positive input.
Case
The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/C.
Connection Pins
Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd). 3
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Thermal Data
Over-temperature protection
The PKF 5000 series will automatically shut down when the internal junction temperature of the control IC in the converter reaches typ. 150 C. It will automatically re-start when the junction temperature cools below typ. 140 C.
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in surface mount technology. Extra precautions must therefore be taken when reflow soldering the surface mount version. Neglecting the soldering information given below may result in permanent damage or significant degradation of power module performance. The PKF series can be reflow soldered using IR, Natural Convection, Forced Convection or Combined IR/Convection Technologies. The high thermal mass of the component and its effect on DT (C) requires that particular attention be paid to other temperature sensitive components. IR Reflow technology may require the overall profile time to be extended to approximately 8-10 minutes to ensure an acceptable DT. Higher activity flux may be more suitable to overcome the increase in oxidation and to avoid flux burn-up. The general profile parameters detailed in the diagram, with this extended time to reach peak temperatures, would then be suitable. Note! These are maximum parameters. Depending on process variations, an appropriate margin must be added.
Two-parameter model
This model provides a more precise description of the thermal characteristics to be used for thermal calculations. Thermally the power module can be considered as a component and the case temperature can be used to characterize the properties. The thermal data for a power module with the substrate in contact with the case can be described with two thermal resistances. One from the case to ambient air and one from case to PB (Printed Board). The thermal characteristics can be calculated from the following formula: TPB = (TC-TA)x(Rth C-PB+Rth C-A)/Rth C-A-PdxRth C-PB+TA dissipated power, calculated as PO x(l/h-1) max average case temperature ambient air temperature at the lower side of the power module temperature in the PB between the PKF connection pins TPB: Rth C-PB: thermal resistance from case to PB under the power module Rth C-A: thermal resistance from case to ambient air v: velocity of ambient air. Rth C-PB is constant and Rth C-A is dependent on the air velocity. Free convection is equal to an air velocity of approx. 0.2 - 0.3 m/s. See figure below. Where: Pd: TC: TA:
Palladium plating is used on the terminal pins. A pin temperature (Tp) in excess of the solder fusing temperature (+183C for Sn/Pb 63/37) for more than 25 seconds and a peak temperature above 195C, is required to guarantee a reliable solder joint. Both pin 1 and pin 9 must be monitored. No responsibility is assumed if these recommendations are not strictly followed.
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EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Safety
The PKF Series DC/DC power modules are designed in accordance with EN 60 950, Safety of information technology equipment including electrical business equipment. SEMKO approval pending. The DC/DC power module shall be installed in an end-use equipment and considerations should be given to measuring the case temperature to comply with TC max when in operation. Abnormal component tests are conducted with the input protected by an external 3 A fuse. The need for repeating these tests in the end-use appliance shall be considered if installed in a circuit having higher rated devices. When the supply to the DC/DC power module meets all the requirements for SELV (<60 V dc), the output is considered to remain within SELV limits (level 3). The isolation is an operational insulation in accordance with EN 60 950. The DC/DC power module is intended to be supplied by isolated secondary circuitry and shall be installed in compliance with the requirements of the ultimate application. If they are connected to a 60 V DC system reinforced insulation must be provided in the power supply that isolates the input from the mains. Single fault testing in the power supply must be performed in combination with the DC/DC power module to demonstrate that the output meets the requirement for SELV. One pole of the input and one pole of the output is to be grounded or both are to be kept floating. The terminal pins are only intended for connection to mating connectors of internal wiring inside the end-use equipment. These DC/DC power modules may be used in telephone equipment in accordance with paragraph 34 A.1 of UL 1459 (Standard for Telephone Equipment, second edition). The galvanic isolation is verified in an electric strength test. Test voltage (VISO) between input and output is 1,500 V dc for 60 s. In production the test duration is decreased to 1 s. The capacitor between input and output has a value of 1 nF and the leakage current is less than 1A @ 53 V dc. The case is designed in non-conductive epoxy. Its flammability rating meets UL 94V-0. The oxygen index is 34%.
Electrical Data
Fundamental circuit diagrams Single output
Transient input voltage
Single voltage pulse at +25 C ambient temperature.
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
5
PKF 5510 PI, SI
TC = -30...+90C, VI = 18 ...72V and pin 8 connected to pin 9 unless otherwise specified. Output
Output 1 Characteristics Conditions min VOi Output voltage initial setting and accuracy TC = +25C, I O = 1.5 A, VI = 53 V Output adjust range1) VO Output voltage tolerance band Long term drift incl. IO = 0.15...1.5 A IO = 0.15...1.5 A, VI = 19-72 V IO = 0.2...1.5 A, VI = 20-72 V Idling voltage IO = 0 A VI = 18...36 V Line regulation IO = 1,5 A VI = 38...60 V VI = 50...72 V Load regulation ttr Load transient recovery time IO = 0.15...1.5 A, VI = 53 V load step = 0.75 A Vtr Load transient voltage -150 Tcoeff tr ts IO POmax Ilim Isc Temperature coefficient2) Ramp-up time Start-up time Output current Max output power2) Current limiting threshold Short circuit current Calculated value TC 1) 2)
Unit typ 3.30 max 3.33 3.80 3.46 3.46 3.42 3.8 30 30 15 50 100 +150 200 mV ms mV mV mV/C ms ms 1.5 A W 2.30 2.7 20 70 80 45 2.50 A A mVp-p dBmV dB mV 4.3 V V V V
3.27 2.80 3.00 3.13 3.17
IO = 0.15...1.5 A, VI = 53 V
IO =1.5 A, TC = + 40...+ 90 C IO = 1.5 A, 0.15...1.5 xVO IO = 0.15...1.5A, VI = 53 V From VI connection to VO = 0...0.9xVOi 0 5 1.65
-0.4 2 5
Supply voltage rejection (ac)
f = 100 Hz sine wave, 1Vp-p, VI = 53 V (SVR = 20 log (1 Vp-p/VOp-p))
See also Operating Information. See Typical Characteristics.
Miscellaneous
Characteristics h Conditions VI = 27 V Efficiency VI = 53 V IO = 1.5 A VI = 27 V Pd Power dissipation VI = 53 V 1.4 1.7 1.2 1.4 W 75 78 min 78 typ 80 % max Unit
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EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
PKF 5611 PI, SI
TC = -30...+90C, VI = 18 ...72V and pin 8 connected to pin 9 unless otherwise specified. Output
Output 1 Characteristics Conditions min VOi Output voltage initial setting and accuracy TC = +25C, IO = 0.2 A, VI = 53 V Output adjust range1) VO Output voltage tolerance band Idling voltage Long term drift included IO = 0 A VI = 18...36 V Line regulation IO = 1.2 A VI = 38...60 V VI = 50...72 V Load regulation ttr Load transient recovery time IO = 0.12...12 A, VI = 53 V load step = 0.6 A Vtr Load transient voltage -120 Tcoeff tr ts IO POmax Ilim Isc Temperature coefficient2) IO = 1.2 A, T C =+40...+ 90 C IO = 1.2 A, 0.1...0.9 xV O IO = 0.1...1.2 A, V I = 53 V From VI connection to VO = 0...0.9 xVOi 0 Calculated value TC 1) 2)
Unit typ 5.05 max 5.08 5.80 5.25 5.7 50 20 10 135 330 +120 mV ms mV mV mV/C 5 10 1.2 ms ms A W 1.8 2.0 50 2.0 3.5 150 80 60 A A mVp-p dBmV dB mV 6.0 V V V V
5.02 4.30 IO = 0.15...1.2 A 4.85
IO = 0.3...1.2 A, VI = 27 V
-1.1 1 2 4.8
Ramp-up time Start-up time Output current Max output power2) Current limiting threshold Short circuit current
6 1.3
Supply voltage rejection (ac)
f = 100 Hz sine wave, 1Vp-p, VI = 53 V (SVR = 20 log (1 Vp-p/VOp-p))
See also Operating Information. See Typical Characteristics.
Miscellaneous
Characteristics h Conditions VI = 27 V Efficiency VI = 53 V IO = 1.2 A VI = 27 V Pd Power dissipation VI = 53 V 1.4 1.6 1.2 1.6 W 79 81 min 79 typ 83 % max Unit
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
7
PKF 5617 PI, SI
TC = -30...+90C, VI = 18 ...72 V and pin 8 connected to pin 9 unless otherwise specified. Output
Output 1 Characteristics Conditions min VOi Output voltage initial setting and accuracy TC = +25C, IO = 0.72 A, VI = 53 V Output adjust range1) VO Output voltage tolerance band Idling voltage Long term drift included IO = 0 A, VI =53 V VI = 18...36 V Line regulation IO =0.86 A VI = 38...60 V VI = 50...72 V Load regulation ttr Load transient recovery time IO = 0.086...0.86 A, VI = 53 V load step = 0.43 A Vtr Load transient voltage -130 Tcoeff tr ts IO POmax Ilim Isc Temperature coefficient2) IO = 0.86 A, TC = + 40... + 90 C IO = IOmax, 0.1...0.9 xVO, VI = 53 V IO = 0.086...0.86 A, VI = 53 V From VI connection to VO = 0.9 xVOi 0 Calculated value TC *1) 12)
Unit typ 7.00 max 7.05 8.05 7.35 7.5 10 10 10 120 350 +130 mV ms mV mV mV/C 5 10 0.86 ms ms A W 1.2 1.8 50 1.6 3.5 150 80 60 A A mVp-p dBmV dB mV 7.9 V V V V
6.95 5.95 IO = 0.086...0.86 A 6.65
IO = 0.08...0.86 A, VI = 27 V
-1.2 1 3 5
Ramp-up time Start-up time Output current Max output power2)
6 1.0
Current limiting threshold Short circuit current
Supply voltage rejection (ac)
f = 100 Hz sine wave, 1Vp-p, VI = 53 V (SVR = 20 log (1 Vp-p/VOp-p))
See also Operating Information. See Typical Characteristics.
Miscellaneous
Characteristics h Conditions VI = 27 V Efficiency VI = 53 V IO = 0.86 A VI = 27 V Pd Power dissipation VI = 53 V 1.3 1.5 1.1 1.5 W 80 82 min 80 typ 84 % max Unit
8
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Typical Characteristics
PKF 5510 PI, SI
Output characteristic (typ) Power derating Efficiency (typ) @ TA = +25C
Temperature coefficient
Turn-on/turn/off input voltage
Dynamic load response (typ) @ +25C
The output voltage deviation is determined by the load transient (dI/dt)
100 mV/div
1 A/div
Load change: dI/dt 4 A/ms
0.2 ms/div
PKF 5611 PI, SI
Output characteristic (typ) Power derating Efficiency (typ) @ TA = + 25C
Temperature coefficient
Turn-on/turn/off input voltage
Dynamic load response (typ) @ + 25C
100 mV/div
The output voltage deviation is determined by the load transient (dI/dt)
1 A/div
Load change: dI/dt 4 A/ms
0.2 ms/div
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
9
PKF 5617 PI, SI
Output characteristic (typ) Power derating Efficiency (typ) @ TA = +25C
Temperature coefficient
Turn-on/turn/off input voltage
Dynamic load response (typ) @ + 25C
100 mV/div
The output voltage deviation is determined by the load transient (dI/dt)
1 A/div
Load change: dI/dt 4 A/ms
0.2 ms/div
10
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
EMC Specifications
The fundamental switching frequency is 510 kHz 26 kHz.
EFT
Electrical Fast Transients on the input terminals could affect the output voltage regulation causing functional errors on the Printed Board Assembly (PBA). The PKF power modules withstand EFT levels of 0.5 kV keeping VO within the tolerance band and 2.0 kV without destruction. Tested according to IEC publ. 801-4.
Conducted EMI (input teminals)
Output Ripple & Noise (VOac)
Output ripple is measured as the peak to peak voltage of the fundamental switching frequency.
Operating Information
Fuse Considerations
PKF series typical conducted EMI performance Test set up
To prevent excessive current from flowing through the input supply line, in the case of a short-circuit across the converter input, an external fuse should be installed in the non-earthed input supply line. We recommend using a fuse rated at approximately 2 to 4 times the value calculated in the formula below: PO max Iin max = (hmin x VI min) For further information, please refer to the fuse manufacturer .
The PKF meets class A in VDE 0871/0878, FCC Part 15J, and CISPR 22 (EN 55022), except for the fundamental switching frequency.
Remote Control (RC)
Turn-on or turn-off can be realized by using the RC-pin. If pin 11 is connected to pin 17 the power module turns off. Normal operation is achieved if pin 11 is open (NC) . To ensure safe turn-off the voltage difference between pin 11 and 17 shall be less than 2.0 V. RC is an TTL open collector compatible output with a sink capacity >300 mA (see fig. 1).
Conducted EMS
Electro Magnetic Susceptibility is measured by injection of electrical disturbances on the input terminals. No deviation outside the VO tolerance band will occur under the following conditions: Frequency range Voltage level 0.15...300 MHz 1.0 Vrms The signal is amplitude modulated with 1 kHz/80% and applied both differential and common mode.
Radiated EMS (Electro-Magnetic Fields)
Radiated EMS is measured according to test methods in IEC Standard publ. 801-3. No deviation outside the VO tolerance band will occur under the following conditions: Frequency range 0.01...200 MHz 200...1,000 MHz 1...12 GHz Voltage level 3 Vrms/m 3 Vrms/m 10 Vrms/m
Figure 1
ESD
Electro Static Discharge is tested according to IEC publ. 801-2. No destruction will occur if the following voltage levels are applied to any of the terminal pins: Test Voltage level Air discharge 4 kV Contact discharge 2 kV
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Over Voltage Protection (OVP)
The remote control can also be utilized for OVP by using the external circuitry in figure 2. Resistor values are for 5 V output applications, but can easily be adjusted for other output voltages and the desired OVP level. 11
Figure 4
Capacitive Load
Figure 2
The PKF series has no maximum limit for capacitive load on the output. The power module may operate in current limiting mode during start-up, affecting the ramp-up and the start-up time. For optimum start performance we recommend maximum 100 mF/A of IO. Connect capacitors at the point of load for best performance.
Output Voltage Adjust (Vadj)
Output voltage, VO, can be adjusted by using an external resistor. Typical adjust range is 15%. If pin 8 and 9 are not connected together the output will decrease to a low value.To increase VO a resistor should be connected between pin 8/9 and 17, and to decrease VO a resistor should be connected between pin 8 and 9 (see fig. 4). Typical required resistor value to increase VO is given by: Radj = k1x(k2 - VO)/(VO - VOi), (kW) where and VO is the desired output voltage VOi is the typical output voltage initial setting k1=3.18 k1=3.18 k1=3.18 k2=3.86 k2=5.93 k2=8.05 PKF 5510 PKF 5611 PKF 5617
Parallel Operation
Paralleling of several converters is easily accomplished by direct connection of the output voltage terminal pins. The load regulation characteristic is specifically designed for optimal paralleling performance. Load sharing between converters will be within 10%. It is recommended not to exceed PO = n x 0.9 x PO max, where POmax is the maximum converter output power and n the number of paralleled converters, to prevent overloading any of the converters and thereby decreasing the reliability performance.
Current Limiting Protection (Ilim)
The output power is limited at loads above the output current limiting threshold (Ilim), specified as a minimum value.
Typical required resistor value to decrease VO is given by: Radj = k3 x (VOi -VO)/(VO - k4), (kW) where k3=13.0 k3=12.6 k3=12.6 k4=2.75 k4=4.28 k4=5.95 PKF 5510 PKF 5611 PKF 5617
Synchronization (Sync)
It is possible to synchronize the switching frequency to an external symmetrical clock signal. The input is TTL-compatible and referenced to the input pin 17.
Characteristic
min
typ
max
unit
High level Threshold level*) Low level Sink current Sync. frequency
*)
2.2 1.2 0 520
1.7
6.5 2.2 0.4 1.5 688
V V V mA kHz
Rise time <10ns
Input and Output Impedance
Figure 3
Voltage Margining
For voltage controlled margining e.g. at final test, the following setup can be used. By increasing the control voltage V1 to +10 V the output voltage decreases 5% of VOi, and by decreasing V1 to -10 V the output voltage increases 5%. 12
Both the source impedance of the power feeding and the load impedance will interact with the impedance of the DC/DC power module. It is most important to have the ratio between L and C as low as possible, i.e. a low characteristic impedance, both at the input and output, as the power modules have a low energy storage capability. Use an electrolytic capacitor across the input if the source is larger than 10 mH. Their equivalent series resistance together with the capacitance acts as a lossless damping filter. Suitable capacitor values are in the range 10-100 mF.
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Delivery Package Information
Tubes
The PKF-series is delivered in tubes (designated by /A) with a length of 500 mm (19.69 in), see fig. 5.
Capacity: Stacking pitch: Weight: Min. order quantity:
15 power modules/tray 10.16 mm Typ. 130 g 150 pcs (one box contains 10 full trays)
Tape & Reel
SMD versions, SI, can be delivered in standard tape & reel package (designated by /C) on request, see fig. 7. For more information, please contact your local Ericsson sales office.
Figure 5
Specification
Material: Max surface resistance: Color: Capacity: Weight: End stops:
Antistatic coated PVC 1011W/ Transparent 10 power modules/tube Typ. 60 g Pins
Trays
SMD versions, SI, can be delivered in standard JEDEC trays (designated by /B) on request, see fig. 6. For more information, please contact your local Ericsson sales office.
Figure 7
Specification
Tape material: Tape width: Tape pitch: Max surface resistance: Tape color: Cover tape color: Reel diameter: Reel hub diameter: Reel capacity: Full reel weight: Min. order quantity:
Conductive polystyrene (PS) 72 mm 36 mm 105W/ Black Transparent 13" 7" 150 pcs Typ. 3.7 kg 300 pcs (one box contains two reels)
Figure 6
Specification
Material: Max temperature: Max surface resistance: Color:
Polypropylene (PP) 125 C 105W/ Black 13
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
Quality
Reliability
Meantime between failure (MTBF) is calculated to >4.9 million hours at full output power and a pin temperature of +55C (TA = +40C), using the Ericsson failure rate data system. The Ericsson failure rate data system is based on field failure rates and is continously updated. The data corresponds to actual failure rates of components used in Information Technology and Telecom equipment in temperature controlled environments (TA = -5... +65C). The data is considered to have a confidence level of 90%. For more information see Design Note 002.
Quality Statement
The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6 s and SPC, are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out by a burn-in procedure and an ATE-based final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products.
Warranty
Ericsson Microelectronics warrants to the original purchaser or end user that the products conform to this Data Sheet and are free from material and workmanship defects for a period of five (5) years from the date of manufacture, if the product is used within specified conditions and not opened. In case the product is discontinued, claims will be accepted up to three (3) years from the date of the discontinuation. For additional details on this limited warranty please refer to Ericsson Microelectronics AB's "General Terms and Conditions of Sales", or individual contract documents.
Limitation of liability
Ericsson Microelectronics does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person's health or life).
Information given in this data sheet is believed to be accurate and reliable. No responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice.
14
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) (c) Ericsson Microelectronics, June 2000
15
Product Program
VI VO/IO max Output 1 24/48/60 V (max 75 V dc) 3.3 V/1.5 A 5 V/1.2 A 7 V/0.86 A 5W 6W 6W PO max Ordering No.*) Through-hole PKF 5510 PI PKF 5611 PI PKF 5617 PI
*)
SMD PKF 5510 SI PKF 5611 SI PKF 5617 SI
See also Delivery Package Information
Ericsson Microelectronics AB SE-164 81 KISTA, Sweden Phone: +46 8 757 5000 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int. +46 8 757 4700, Fax: +46 8 757 4776
The latest and most complete information can be found on our website!
Data Sheet
EN/LZT 146 32 R1A (Replaces EN/LZT 137 30 R5) (c) Ericsson Microelectronics AB, June 2000


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